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Pitch, YFF0006, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition Appendix A Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l031f6.pdf WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 10x10mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for the articles that helped implement this. Ct = -0.1; // circle translate? Not sure. Circle_radius = knob_radius_top; // just match the height about right. I suggest the following procedure for assembly. As usual do the lowest components first — resistors and diodes — then sockets, ceramic capacitors, power header, transistors, film caps, electrolytic caps... Something like that. Latest commits for file Synth Mages Power Word Stun.kicad_prl", 3D Printing/AD&D 1e spell names in Filmoscope Quentin/FIREBALL VCO.png differ Binary files /dev/null and b/sr1_full.png differ aac0a4a5b4 Notes from MK's PCB livestream 7e24b3de83ed5d44b4cd8ae11f345f795b25c6b7 Upload files to '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/MAGIC MISSILE VCF.png' 06850ab678 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/MAGIC MISSILE VCF.png' f1ff8406b4 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/COLOR SPRAY.png and /dev/null.

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