Notes from MK's PCB livestream

PCB Notes.txt

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+Footprints:
+- avoid non-circular holes in footprints whenever possible; some fabs charge more for ovals
+
+PCB layout:
+- make power connection traces larger; MK uses .6mm
+-- this means from the IDC through the power safety block and into any non-high-impedence connections; that is, fat traces to chip power, but not necessary for voltage dividers feeding chip inputs
+- don't do manual connection to GND if you can avoid it.  wait and use a ground plane.
+- when two traces cross on opposite sides of the board, cross at 90° to minimize capacitance between traces
+- vias connect through the board, connecting a trace on one side to a trace on the other
+
+Ground planes:
+- ground planes are copper fill applied everywhere there isn't a trace already
+- use spokes where ground planes connect to holes - these gaps reduce heat conduction during soldering
+- ground plane spokes can be the same size as traces - .3mm for non-power lines, .6mm if carrying power
+- MK uses a ground plane on only one side when convenient.  You can use one on both sides, or do partial planes where convenient.
+