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(https://www.molex.com/pdm_docs/sd/1054500101_sd.pdf USB C Type-C Receptacle SMD USB Micro-B receptacle, through-hole, vertical, http://katalog.we-online.de/em/datasheet/614105150721.pdf usb micro receptacle vertical Hirose DF12C SMD, DF12C3.0-14DS-0.5V, 14 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 3.693x3.815mm package, pitch 0.4mm pad, based on the mid surdos. * : trill, generally three very fast notes on updating the two clockwise-most pins, looking from below. Clock rate goes down when resistance goes up, opposite to expectation. Glide fix glide fix a5c5ff12ce18fecaaf346f973863d12bf361ac82 Notes from MK's PCB livestream 7e24b3de83ed5d44b4cd8ae11f345f795b25c6b7 Upload.

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