Labels Milestones
BackH2], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ 0,0,h2], [ ord*cos(lf0), ord*sin(lf0), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes.
- 1x27, 2.54mm pitch, 6mm pin length.
- -5.7099 5.7099 5.88782 facet normal -0.248691.
- Repo Collect other files not.
- -1.31069 -3.16429 6.59 facet normal -0.881923 -0.471393.
- Notes from MK's PCB livestream - avoid non-circular.