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Size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 12x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 5x-dip-switch SPST CTS_Series194-5MSTN, Piano, row spacing 15.24 mm (600 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 2.54mm staggered type-2 TO-220-4 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-7 Vertical RM 2.286mm SIPAK Horizontal RM 1.7mm Pentawatt Multiwatt-5 TO-220-5, Vertical, RM 1.27mm, staggered type-1 TO-247-2, Horizontal, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Horizontal RM 1.7mm MultiwattF-11 staggered type-2 TO-220-4 Vertical RM 2.54mm TO-247-5, Horizontal, RM 5.08mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-3 Horizontal RM 1.7mm staggered type-1 TO-220F-4, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Horizontal RM 2.54mm TO-247-5, Horizontal, RM 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 0.9mm staggered type-2 TO-220F-5 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220F-9, Vertical, RM 2.54mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 1.7mm staggered type-2 TO-220-7 Vertical RM 2.54mm staggered type-2 TO-220F-5, Vertical, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Horizontal RM 5.08mm TO-220-2, Vertical, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=28 FBGA-96, 14.0x9.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=24 FBGA-78, 10.5x8.0mm, 78.

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