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Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket 5-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 10x-dip-switch SPST , Slide, row spacing 7.62 mm.

Toggle: probably too short without extra.
Connectors (MCRF), mates Hirose U.FL, (http://www.molex.com/pdm_docs/sd/734120110_sd.pdf.
0.787396 -0.189041 0.586746 facet normal.
17 .../fastestenv_Trimmer_Pot_Hole.kicad_mod | 17 .../Kosmo_Panel_Dual_Mounting_Holes.kicad_mod.

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