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BackPrecadsr-panel.kicad_pcb Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: unplated through holes: unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes unplated through holes: unplated through holes: ============================================================= c9e81f0cc630cea052574ce7c50b3e82145bb626 Image of caxia score Fireball/Fireball.kicad_dru Normal file View File 3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/COLOR SPRAY.png and /dev/null differ with a capacitor / resistor pair, see Fireball's hard sync to schematic, laid out PCB with exploratory 8hp layout Schematics/Enlarge/Enlarge.kicad_prl | 10 uF tantalum\nMFOS 1, 1+15 µF electrolytic.\n1 µF tanty looks better than EL\n(higher output, less leakage)\nbut only by a little. 1 µF tantalum.\nYuSynth 1, 10 µF tanty looks better than EL\n(higher output, less leakage)\nbut only by a little. 1 uf \npolyester film looks much \nbetter. Low-Power, Quad-Operational Amplifiers, DIP-14/SOIC-14/SSOP-14
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