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Banana panel socket, through-hole, row spacing 11.48 mm (451 mils 12-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 2.54mm 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 10.8x4.1mm DIP Switch SPST Slide 5.08mm 200mil SMD JPin SMD 1x-dip-switch SPST Copal_CVS-01xB, Slide, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 6x-dip-switch SPST Omron_A6H-6101, Slide, row spacing 6.15 mm (242 mils), body size.

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