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BackSimulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes Total unplated holes count.
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- 32x5.6x17mm rectifier package, 3.95mm pitch.
- Normal -0.758298 0.622316 0.194183 vertex.