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BackGB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST ZE series connector, S3B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Hirose series connector, SM12B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 1.5mm, hole diameter 1.2mm THT pad as test Point, diameter 4.0mm 2 pins LED, , diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 3.0mm 2 pins LED diameter 5.0mm 2 pins diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 1.6mm 2 pins LED, , diameter 1.8mm size 1.8x2.4mm^2 z-position of.
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