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3.429106e-04 vertex -9.322219e+01 1.047675e+02 2.655000e+01 facet normal 0.0817724 -0.0814632 0.993316 vertex 4.77321 4.19228 7.82455 vertex 6.33525 0.41258 7.82405 facet normal -0.956937 -0.288339 0.0336393 facet normal 0.584876 -0.805015 0.0993523 facet normal -0.0980238 -0.995184 -0 facet normal -0.652551 0.754471 0.0703597 vertex 0.852093 -11.3704 0.18985 facet normal -0.991506 0.0943295 0.089547 facet normal 0.095084 0.0293294 -0.995037 facet normal 0.499997 0.866027 1.22083e-07 vertex -2.40611 1.85105 6.59 facet normal -0 0.995043 0.0994409 facet normal 8.406740e-02 -9.964600e-01 3.534831e-04 facet normal 0.0906197 0.920082 0.381101 facet normal 7.556493e-16 -1.379743e-15 -1.000000e+00 facet normal 0.60884 0.184688 0.771495 facet normal -0.988483 -0.0979878 0.115323 facet normal -2.880153e-004 -5.040268e-004 -9.999998e-001 ## Documentation: * [Schematic](Docs/precadsr.pdf) * PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf ## Git repository * [https://github.com/holmesrichards/precadsr](https://github.com/holmesrichards/precadsr ## Submodules This repo uses submodules aoKicad and Kosmo_panel. To clone: ``` git clone git@github.com:holmesrichards/precadsr.git git submodule init git submodule update Find and replace last few thin traces, fix teardrops and gnd fill Find and replace last few thin traces, fix teardrops and gnd fill Embiggen traces, add teardrops updated C5 footprint & tracing; schematic annotation updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 5.9 mm (232 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 10x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils.

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