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BackForm 1A, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_SIL.pdf Standex-Meder SIL-relais, Form 1A, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_SIL.pdf Standex Meder DIP reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 2.54mm 10.16mm 400mil Socket 3M 24-pin zero insertion force socket, though-hole, row spacing 15.24 mm (600 mils Toshiba 11-7A9 DIL DIP PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=27.
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