Labels Milestones
BackFF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A Spartan-7 BGA, 15x15 grid, 13x13mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.4mm; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375.
- 0.586762 vertex 2.06904 0.821707 19.9 vertex.
- 6.34429 6.34429 4.79464 facet normal 0.681165 0.725369 0.0992665.
- Size 30.5x9.8mm^2 drill 1.3mm pad 2.6mm terminal.
- Vertex 2.567783e+000 4.415591e+000 2.488700e+001.