Labels Milestones
BackSMD 2x09 2.00mm double row Through hole angled socket strip, 1x37, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header SMD 2x13 2.00mm double row Through hole angled socket strip THT 1x02 2.54mm single row Through hole socket strip THT 1x30 2.54mm single row style2 pin1 right Through hole angled pin header, 1x19, 2.54mm pitch, double rows Surface mounted pin header SMD 1x19 1.00mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip THT 1x12 2.00mm single row Surface mounted pin header SMD 2x02 1.00mm double row Through hole pin header SMD 1x08 2.54mm single row Surface mounted pin header SMD 2x10 2.54mm double row surface-mounted straight socket strip, 1x28, 1.27mm pitch, 4.4mm socket length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight pin header, 2x19, 1.27mm pitch, double rows Through hole angled socket strip THT 1x17 1.27mm single row style2 pin1 right Through hole angled socket strip SMD 1x08 1.00mm single row Surface mounted socket strip SMD Solder 3-pad Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strip, labeled with numbers SMD Solder Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strips SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 2 From 5082711a9800483ca58d4b1dffec55bdf27856b9 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Initial commit Dual VCA, based roughly on Moritz Klein's schematic, with features added from Skull and Circuit's VCA v1.3. 3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/COLOR SPRAY.png create mode 100644 Images/IMG_6753.JPG create mode 100644 3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/BLADE BARRIER.png differ Binary files /dev/null and b/Panels/FireballSpell_Large_bw.png differ Binary files a/3D Printing/Panels/FIREBALL VCO.png differ Binary files /dev/null and b/Futura Heavy BT.ttf => Panels/Futura Heavy BT.ttf → Panels/Futura Heavy BT.ttf → Panels/Futura Heavy BT.ttf → Panels/Futura Heavy BT.ttf | Bin 0 -> 36336 bytes.
- MCV_1,5/3-G-3.5; number of pins: 15; pin pitch: 5.08mm.
- 1.359026e-001 vertex -6.905809e-001 -5.424677e+000.
- 0.927051 -2.85317 0 vertex -0.927051 2.85317.
- 4.0x2.8mm^2 diameter 2.0mm SMD.