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BackLayer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes: unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes Total unplated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4.
- Normal 0.995185 0.0980159 0 facet normal.
- (https://pdfserv.maximintegrated.com/package_dwgs/21-100172.PDF), generated with kicad-footprint-generator JST SUR.
- -2.01 0.85 (end 2 -0.95 (end.