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BackSimulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole Total plated holes count 16 ============================================================= Total unplated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes Total unplated holes count 0 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/R_Axial_DIN0207_L6.3mm_D2.5mm_P7.62mm_Horizontal.kicad_mod Normal file View File Schematics/shaek_try_1.diy Normal.
- Pitch 20.00mm diameter 12.7mm Vishay.
- 0.0992813 facet normal 4.225726e-001 1.881832e-003 9.063271e-001 facet normal.