Labels Milestones
BackThough-hole, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 22-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900.
- 0.767777 0.634425 0.0895734 facet normal.
- (https://www.jedec.org/system/files/docs/MO-220K01.pdf (variation VJJD-5)), generated with.