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Series (https://docs.broadcom.com/docs/AV02-3283EN TSL2550 ambient light sensor, i2c interface, 6-pin chipled package, https://docs.broadcom.com/docs/AV02-2315EN ambient light sensor, i2c interface, 6-pin chipled package, http://optoelectronics.liteon.com/upload/download/DS86-2013-0004/LTR-303ALS-01_DS_V1.pdf Optoisolator with LED and photoresistor 3 Lead Plastic Package OnSemi CASE 100CY, light-direction upwards, see https://www.everlight.com/file/ProductFile/ITR1201SR10AR-TR.pdf reflective opto couple photo coupler IR Receiver Vishay TSOP-xxxx MINICAST IR Receiver Vishay TSOP-xxxx, CAST package, see https://www.vishay.com/docs/82669/tsop32s40f.pdf IR Receiver Vishay TSOP-xxxx MINIMOLD IR Receiver Vishay TSOP-xxxx, CAST package, see https://www.vishay.com/docs/82493/tsop311.pdf package for diode bridges, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 2.54mm 25.4mm 1000mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300.

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