3
1
Back

(see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 3x-dip-switch SPST CTS_Series194-3MSTN, Piano, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 10x-dip-switch SPST Omron_A6H-10101, Slide, row spacing 11.48 mm (451 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=24.

New Pull Request