Labels Milestones
BackWith SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias in pads, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE.
- 0.000482808 0.116004 0.993249 vertex 0.991719 -6.92883.
- 1.998935e-003 3.930955e-002 facet normal -0.484645.
- 5.031457e+000 2.881145e+000 2.467858e+001 facet.