Labels Milestones
Back4.4084x3.7594mm package, pitch 0.5mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x02 2.00mm single row Through hole horizontal IDC box header THT 1x37 1.27mm single row style1 pin1 left Surface mounted socket strip SMD 2x11 1.00mm double row Through hole pin header THT 1x06 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x27 2.00mm single row Through hole straight socket strip, 2x38, 1.27mm pitch, single row style2 pin1 right Through hole socket strip THT 2x14 2.00mm double row surface-mounted straight socket strip, 1x10, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x29, 2.00mm pitch, double rows Through hole angled socket strip, 2x21, 2.54mm pitch.
- Bottom-side contacts 1.0mm pitch 1.0mm height SMT HDMI.
- , length*width=11.5*8.8mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf.
- Cc6dd0b3d5 Checkpoint before trying.