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(https://www.infineon.com/dgdl/ir4302.pdf?fileId=5546d462533600a4015355d602a9181d, https://www.infineon.com/dgdl/Infineon-AN1170-AN-v05_00-EN.pdf?fileId=5546d462533600a40153559ac3e51134 14-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled pin header SMD 1x15 1.00mm single row (from Kicad 4.0.7!), script generated Surface mounted pin header THT 2x03 2.00mm double row Through hole socket strip THT 2x13 2.54mm double row Through hole socket strip THT 2x35 2.00mm double row Through hole angled pin header, 2x22, 1.00mm pitch, 2.0mm pin length, single row style2 pin1 right surface-mounted straight pin header, 2x38, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x39, 1.27mm pitch, double cols.

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