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HTSSOP, 24 Pin (http://www.thatcorp.com/datashts/THAT_5173_Datasheet.pdf#page=17), generated with kicad-footprint-generator ipc_noLead_generator.py DC6 Package; 6-Lead Plastic DFN (3mm x 2mm) 0.40mm pitch DDB Package; 12-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (5mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 14-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package (MC) - 2x3x0.9 mm Body [TQFP] With Exposed Pad Variation; (see NXP sot054_po.pdf TO-92 horizontal, leads in-line, wide, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile DIP Switch SPST Slide 6.15mm 242mil SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 1x-dip-switch SPST Copal_CHS-01B, Slide, row.

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