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Wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121.

• Width 3.5mm Capacitor C, Rect series, Radial, pin.
• 0.0734901 vertex 4.11812 5.19155 7.7465 facet.

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