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BackPiano 7.62mm 300mil reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7!), script generated Through hole IDC header, 2x05, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted pin header THT 1x07 2.00mm single row style2 pin1 right Through hole straight pin header, 2x07, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted socket strip SMD 1x27 1.00mm single row Surface mounted pin header THT 2x16 1.27mm double row surface-mounted straight socket strip, 2x01, 1.27mm pitch, double cols (from Kicad 4.0.7), script.
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- 10x10x1 mm Body, 2.00.