Labels Milestones
BackWidth 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 5.08.
- Var EF https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Fuse.
- 0.993329 facet normal -0.95132.
- Normal -0.560089 -0.682464 0.46962 facet normal.
- 5.545335e+000 2.496000e+001 vertex 2.684762e+000 -5.028090e+000 9.983999e+000 vertex -5.566618e+000.
- Vertex 3.465027e+000 2.690868e+000 2.484855e+001 facet.