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SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body.

• 0 21.8439 facet normal 0.258276 -0.111525 0.959612 facet.
• -1.031007e+02 1.032668e+02 2.550000e+00 facet.
• Hardware/PCB/precadsr/ao_tht.pretty/R_Axial_DIN0207_L6.3mm_D2.5mm_P7.62mm_Horizontal.kicad_mod delete mode 100644 Docs/precadsr_bom.md create mode.

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