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TDK InvenSense MEMS I2S SPH0645LM4H Knowles Sensirion, SHT40, SHT41, SHT45, DFN, 4 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-36DS-0.5V, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0830, 8 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TDFN, 12 Pads, No exposed, http://www.st.com/resource/en/datasheet/stm6600.pdf TDFN, 14 Pin (https://www.st.com/resource/en/datasheet/lsm6ds3tr-c.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WQFN, 16 Pin package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils THT DIP DIL ZIF 25.4mm 1000mil Socket 40-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP Switch SPST Slide 7.62mm 300mil PowerIntegrations variant of 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body.

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