Labels Milestones
Back23 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0 TE FPC connector, 06 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0 TE FPC connector, 10 bottom-side contacts, 1.0mm pitch, 1.0mm height, SMT, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84953&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84953-4 TE FPC connector, 39 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0 TE FPC connector, 19 top-side contacts, 1.0mm pitch, 1.0mm height, SMT, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84953&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84953-4 TE FPC connector, 22 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0 TE FPC connector, 30 top-side contacts, 0.5mm pitch, 1.854mm thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package (MR) - 9x9x0.9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 932BH.PDF TQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/SOT414-1.pdf), generated with kicad-footprint-generator JST PHD series connector, 14110213002xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13002XXX_100228421DRW035C.pdf), generated with kicad-footprint-generator Molex Panelmate series connector, B02P-NV (http://www.jst-mfg.com/product/pdf/eng/eNV.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-24S-0.5SH, 24 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4040, 4 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated.
- HLE-146-02-xx-DV-TE, 46 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated.
- For: MC_1,5/6-G-3.81; number of pins: 05.