Labels Milestones

Back

LongPads 32-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils.

• Assembly Regarding the board that will be thinner.
• 4.58534 7.81694 facet normal 0.0348321 0.996913 -0.0703602 facet.
• 43160-1103, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects