Labels Milestones
BackHttp://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x01, 2.00mm pitch, 4.2mm pin length, single row style1 pin1 left Surface mounted socket strip SMD 1x12 2.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x11, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole horizontal IDC header THT 1x01 2.00mm single row style2 pin1 right Through hole angled socket strip, 1x24, 1.27mm pitch, 4.4mm socket length, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header SMD 1x40 2.54mm single row Through hole pin header THT 2x31 2.00mm double row Through hole IDC header, 2x32, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x15 2.54mm double row Through hole socket strip THT 1x22 2.00mm single row style2.
- 9bb3093b2bc14210884f0107e7a2898b2161266b Delete '3D Printing/AD&D 1e.
- WAGO 236-524 45Degree pitch 5mm size 35x9.8mm^2 drill.