Labels Milestones
Back0.8mm 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 12-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 20-lead though-hole.
- 32.5mm Bourns 2300 L_Toroid, Horizontal series, Radial.
- 3.956343e-03 3.767823e-02 vertex -1.042410e+02 9.725134e+01.