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Of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 3.347x3.585mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 3.693x3.815mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf WLCSP-49, 7x7 raster, 3.89x3.74mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (SM) - 5.28 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad TSSOP HTSSOP 0.65 thermal pad LQFP, 32 Pin (JEDEC MO-194 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST GH series connector, 505405-1170 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 24 Pin (https://www.st.com/resource/en/datasheet/led1642gw.pdf#page=34), generated with StandardBox.py) (https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_power_slf10165_en.pdf Inductor, TDK, SLF6028, 6.0mmx6.0mm (Script generated with kicad-footprint-generator JST XH series connector, S13B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator JST PUD series connector, S10B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic thin shrink small outline transistor (see http://www.onsemi.com/pub/Collateral/NST3906F3-D.PDF 3-pin SuperSOT package https://www.fairchildsemi.com/package-drawings/MA/MA03B.pdf 6-pin SuperSOT package http://www.mouser.com/ds/2/149/FMB5551-889214.pdf 8-pin SuperSOT package, http://www.icbank.com/icbank_data/semi_package/ssot8_dim.pdf Power MOSFET package, TDSON-8-1, 5.15x5.9mm (https://www.infineon.com/cms/en/product/packages/PG-TDSON/PG-TDSON-8-1/ TO-50-3 Macro T Package Style M236 TO-50-4 Macro X Package Style M236 TO-50-4 Macro X Package Style M238 TO-252 / DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/ TO-252/DPAK SMD package, tab to pin 1, https://www.wolfspeed.com/media/downloads/137/C3D06060G.pdf D2PAK DDPAK TO-263 D2PAK-9 TO-263-9 TO-268/D3PAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/ TO-263/D2PAK/DDPAK SMD package, http://www.ti.com/lit/ds/symlink/lm4755.pdf D2PAK DDPAK TO-263 D2PAK-9 TO-263-9 TO-268/D3PAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/ DPAK TO-252 DPAK-5 TO-252-5 TO-263 / D2PAK / DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-5-11/ TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-3-1/ TO-263/D2PAK/DDPAK SMD package, http://www.onsemi.com/pub/Collateral/ENA2192-D.PDF Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A Artix-7 BGA, 16x16 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm.

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