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Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.5mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole pin header THT 2x08 2.00mm double row Through hole straight pin header, 1x22, 1.27mm pitch, double rows Through hole angled pin header, 1x11, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x27 1.27mm single row style2 pin1 right Through hole IDC header, 2x25, 2.54mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole angled socket strip SMD 1x20 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x27 2.54mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole socket strip SMD 1x39 1.00mm single row Surface mounted socket strip SMD 1x03 2.54mm single row Through hole pin header THT 2x21 2.00mm double row surface-mounted straight socket strip, 2x36, 2.00mm pitch, 4.2mm pin length, double rows Through hole socket strip THT 1x10 2.54mm single row Surface mounted pin header THT 1x06 1.27mm single row Through hole socket strip THT 1x07 1.00mm single row Surface mounted pin header.

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