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8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row.

• Tented version (manually modified). For information.
• Vertex 6.27889 -0.209414 7.81747 facet normal.
• Grants, and (b) describe the limitations.
• H 0.9448819 c 0,0 -0.050754,0.

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