Labels Milestones
Back3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 2.54 8-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to trigger, gate jack is normalized\nto +12 V, 10 mA -12 V ## Photos ### Photos ## Documentation: * [Schematic](Docs/precadsr.pdf) * PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf * [How to use](Docs/use.md 96f746fa2d Final tweaks, version submitted to JLCPCB on 20240124 Experimenting with more panel layout Start of LM13700 version to see why 5ff3077e8252367b7eceb0b21b0803904b695d42 Fix.
- 9.173371e+01 2.550000e+00 facet normal -0.135125 -0.297024 0.945261 facet.
- 0.550857 0.679089 0.485175 vertex 4.6363.