Labels Milestones
BackPin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=276), generated with kicad-footprint-generator connector wire 0.75sqmm double-strain-relief Soldered wire connection with feed through strain relief, for 4 times 0.25 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 1.7mm, outer diameter 3.5mm, size 21x6.5mm^2, drill diamater 1.2mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal.
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