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Connector, 43160-2102, With thermal vias in pads, 4 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 80.

• 0 7.81454 facet normal 0.683022 0.618138.
• Submodules. // smoothing the top surface.
• Mess More traces and vias.

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