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SQ MOSFET Infineon DirectFET MZ MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET M2 MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET SH MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET MX MOSFET Infineon DirectFET L6 MOSFET Infineon PLCC, 20 pins, surface mount common mode bead Coilcraft 0805USB Series Common Mode Choke, https://www.coilcraft.com/pdfs/0603usb.pdf surface mount PLCC, 20 pins, single row male, vertical entry Harwin LTek Connector, 12 pins, pitch 5mm, size 35x9.8mm^2, drill diamater 1.15mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix MKDS-1,5-10-5.08, 10 pins, pitch 10mm, size 65x9mm^2, drill diamater 1.5mm, 2 pads, pad diameter 2.5mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_317011_RT11LxxHGLU_OFF-022798U.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type086_RT03402HBLC, 2 pins, pitch 5mm, size 35x9mm^2, drill diamater 1.3mm, pad diameter 1.4mm, outer diameter 2mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM14B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B05B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2103, With thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 40-lead though-hole mounted DIP package.

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