3
1
Back

WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic QFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 16-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic Micro Small Outline (ST)-4.4 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DFN, 10 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0429.PDF), generated with StandardBox.py) (https://product.tdk.com/info/en/document/catalog/smd/inductor_commercial_power_slf7032_en.pdf Inductor, TDK, SLF7032, 7.0mmx7.0mm (Script generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin, dual row male, vertical entry Harwin LTek Connector, 26 pins, dual row male, vertical entry, strain relief clip Harwin LTek Connector, 10 pins, pitch 5mm, size 25x10.5mm^2, drill diamater 1.4mm, pad diameter 2.4mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 804-104 45Degree pitch 5mm size 12.3x14mm^2 drill 1.15mm pad 3mm Terminal Block WAGO 236-304 45Degree pitch 5mm size 36.5x15mm^2 drill 1.2mm pad 2.3mm terminal block connector http://www.phoenixcontact.com/us/products/1814760/pdf PhoenixContact PTSM0.5 2 2.5mm vertical SMD spring clamp terminal block Metz Connect Type205_RT04503UBLC 45Degree pitch 7.5mm Varistor, diameter 21.5mm, width 6.7mm, pitch 10mm Varistor, diameter 15.5mm, width 4mm, pitch 7.5mm size 92.3x14mm^2 drill 1.15mm pad 3mm Terminal Block 4Ucon.

New Pull Request