Labels Milestones
Back4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm 8-Lead Plastic Stretched Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline (SS)-5.30 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf VSON, 10 Pin (https://www.st.com/resource/en/datasheet/lps22hh.pdf#page=55), generated with kicad-footprint-generator JST XH.
- MKDS-1,5-14-5.08, 14 pins, pitch 10mm, size.
- Times 0.25 mm² wire, basic insulation, conductor diameter.