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Back| 475 create mode 100644 Fireball/Fireball.kicad_prl create mode 100644 Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Potentiometer_Alpha_RD902F-40-00D_Dual_Vertical_CircularHoles_centered.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/TerminalBlock_Degson_DG301_1x03_P5.00mm_Vertical.kicad_mod delete mode 100644 Hardware/Panel/precadsr_panel_al/precadsr_panel_al.kicad_pcb create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Potentiometer_Bourns_3296W_Vertical_screw_centered.kicad_mod delete mode 100644 Panels/title_test.scad From 16c50fa0a87ddc27dfbf2c780c81516736a5bb00 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Update to 7.0, slider footprint Add footprint items for panel holes; separate panel and pcb into different files Fireball/Fireball.kicad_pcb | 2 Panels/futura medium bt.ttf // 13 SPDT switches 1 rotary switch, 5+ positions - 10 LEDs - 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf ST UQFN 6 pin 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat Pack, 3x3mm Body, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm 8-Lead Plastic Small Outline (ST)-4.4 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Molex CLIK-Mate series connector, BM03B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 1 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector Harwin M20 side entry Molex CLIK-Mate top entry Molex Pico-Clasp side entry Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, FH12-14S-0.5SH, 14 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf.
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