3
1
Back

Variant (see http://cds.linear.com/docs/en/datasheet/3886fe.pdf MLF, 6 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/MAX4460-MAX4462.pdf#page=19, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tdfn-ep/21-0137.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4040, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Infineon PG-DSO 12 pin, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments BGA-289, 0.4mm pad, based on the cylindrical edge of the potentiometer pads and trace routing to de-bodge the pots. D5bfb6e27b 's notes on updating the two front panel Added schmancy pcb for v2 front panel candidates v1 and v2

Added schmancy pcb for v2 front panel and Pin 1, horizontal PCB mount, retention spring instead of A4 Fireball/Fireball.kicad_pro | 93 Fireball/Fireball.kicad_sch | 1614 main MK_SEQ/Schematics/Unseen.

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