Labels Milestones
BackM100 MBGA 121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera BGA-153 M153 MBGA Altera BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 15.24 mm (600 mils 42-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package for diode bridges, row spacing 5.25 mm (206 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 10.16 mm (400 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 8x-dip-switch SPST CTS_Series194-8MSTN, Piano, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (https://ams.com/documents/20143/36005/AS5055A_DS000304_2-00.pdf#page=24), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-129-02-xx-DV-PE-LC, 29 Pins per row (http://www.molex.com/pdm_docs/sd/1053141208_sd.pdf), generated with kicad-footprint-generator JST XH side entry Molex Mini-Fit Jr. Power Connectors, 105313-xx06, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST VH series connector, SM03B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Capacitor SMD Kemet-X (7343-43 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Fuse with Clip, 4.2 x 11.1 mm, Time-Lag T, 250 VAC, 125 VDC (https://us.schurter.com/bundles/snceschurter/epim/_ProdPool_/newDS/en/typ_UMZ_250.pdf fuse smd mount holder SunFuse Ceramic Slow Blow Fuse 6H_6HP.PDF UL/CSA 6x32mm Ceramic Slow Blow Fuse 6H_6HP.PDF UL/CSA 6x32mm Ceramic Slow Blow Fuse Fuseholder TR5 Littelfuse/Wickmann No. 460 No560 Heatsink, 35mm x 26mm, 1x Fixation 3mm, Fischer SK486-35 Heatsink, 38x38mm, Spring Fixation, diagonal, Heatsink, 62 x 40mm, 2x 3mm Drills, Heatsink, 125x35x50mm, 3 fixation holes 3.2mm Heatsink, 12.70mm x 26.16mm x 10.16, SMD, 18K/W, TO-263, D2 Pak, https://www.shopaavid.com/Product/573300D00000G Heatsink AAVID TO-263 D2 Pak Heatsink, 14.48x12.7x19.05mm, TO-220/ TO-262, https://www.boydcorp.com/aavid-datasheets/Board-Level-Cooling-Plug-In-5768.pdf Heatsink, 25.4x25.4x42.54mm, TO-220, https://www.boydcorp.com/aavid-datasheets/Board-Level-Cooling-Channel-5903.pdf Heatsink TV5G TO-220 Horizontal 25x8.3mm Heatsink, 18K/W, TO-220, https://www.fischerelektronik.de/web_fischer/en_GB/$catalogue/fischerData/PR/FK224_220_1_/datasheet.xhtml?branch=heatsinks 26x13 mm SMD heatsink for TO-252 TO-263 TO-268 23x13 mm SMD heatsink for TO-252 TO-263 TO-268 23x13 mm SMD heatsink.
- 0.956708 -2.3097 6.7 vertex 2.45196 0.487725 6.5 vertex.
- Size 85x9mm^2, drill diamater 1.1mm, pad.
- Unescape Hardware/PCB/precadsr/ao_tht.pretty/R_Axial_DIN0207_L6.3mm_D2.5mm_P7.62mm_Horizontal.kicad_mod Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/R_Axial_DIN0207_L6.3mm_D2.5mm_P10.16mm_Horizontal.kicad_mod.
- Number: 1-770967-x, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.
- For: GMSTBVA_2,5/4-G-7,62; number of pins.