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6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 32 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (JEDEC MO-153 Var DB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection, for 2 times 1 mm² wire, basic insulation, conductor diameter 1.4mm, outer diameter 3.5mm, size 42.7x7mm^2.

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