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Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x16.8mm (see.

• Pins black IR-LED, diameter 3.0mm, hole.
• Fsh < 0 ) .
• -9.92115 1.25333 0 facet normal -0.977692 -0.185114 0.0992544.
• -5.28808 -8.58625 2.58057 vertex -7.38961 -6.86157 2.58057 facet.

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