Labels Milestones
BackLTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole) Total plated holes Total unplated holes count 16 ============================================================= Total unplated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes.
- Vertex 7.13321 0 6.87796 vertex -7.13918.
- " /arrasta" c9e81f0cc630cea052574ce7c50b3e82145bb626
- 14.5mm diameter 5.8mm Fastron HBCC Inductor, Axial.
- 0.210322 0 facet normal 0.417286 0.223045 0.880979 vertex.