Labels Milestones
BackST WLCSP-90, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676.
- 43160-0105, 5 Pins per row.
- Number: 22-27-2151, 15 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf.