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Small outline package; 18 leads; body width 16.90 mm Power-Integrations variant of TO-92), also known as TO-226, wide, drill 0.75mm, hand-soldering variant with enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body (see Atmel Appnote 8826 64-Lead Plastic Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [QFN] with thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506BU.PDF 8-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 10-Lead Plastic Dual Flat, No Lead Package (MR) - 9x9x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf TQFP, 48 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/48L_VQFN_6x6mm_6LX_C04-00494a.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VLGA, 4 Pin (http://www.vishay.com/docs/83510/tcmt1100.pdf), generated with kicad-footprint-generator Hirose series connector, B3P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-770874-x, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.

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