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THT 2x46 1.27mm double row Through hole angled pin header SMD 1x18 1.27mm single row Surface mounted pin header THT 2x05 1.27mm double row Through hole angled socket strip SMD 1x23 1.00mm single row 0.8 mm Highspeed card edge connector for PCB's with 60 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 60 contacts (not polarized Highspeed card edge connector for PCB's with 20 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 70 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 08 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 08 contacts (not polarized Highspeed card edge card connector socket for 1.57mm PCBs, vertical, alignment pins, weld tabs (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge connector for 1.6mm PCB's with 05 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 20 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 50 contacts (polarized Highspeed card edge connector for PCB's with 70 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 50 contacts (not polarized Highspeed card edge connector for PCB's with 30 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 30 contacts (not polarized Highspeed card edge card connector socket for 1.57mm PCBs, vertical, alignment pins (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 9x9mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 3.141x3.127mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (ST)-4.4 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 12x-dip-switch SPST , Slide, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil SMD SMD 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row.

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